Product Center
ES50B single-sided copper plate polishing machine
Classify: Single-sided grinding/polishing machine
Parameters
Single-sided grinding/polishing machine
First name Name
ES50B single-sided copper plate polishing machine
Mechanical dimensions
Length 2450 mm × width 1721 mm × height 2900 mm
Mechanical weight
7500KG
Parameters Table
Device parameters
| 50B single-sided copper plate polishing machine | ||||
Fixed plate diameter | Φ1240xΦ350x T13mm （Aluminum base33mm） | |||
| Pressure plate diameter | Φ485mm | |||
| Machine size | 3350x 1721 x 2900mm | |||
| Machine weight | 8000KG | |||
| power supply | 380V/50Hz | |||
| Motor power | 22KW | |||
| Fixed plate rotation number | 0-90RPM/Min | |||
Other parameters
Machine weight | 8000KG | motor | ●0.4KWx4 1.6KW PP Head drive motor ●22KW Bottom plate drive motor |
| power supply | 380V/50Hz | Fixed plate rotation number | ●0~90RPM |
| P.P Number of revolutions | 0~ 80 RPM | P.P greatest pressure | ●300KG |
| Air pressure | 0.6MPa | ||
| Single processing quantity | ●4"piece oneP.P 10piece 4P.P 40piece ●6"piece oneP.P 6piece 4P.P 24piece ●8"piece oneP.P 3piece 4P.P 12piece | Use environment | 15~ 35° C ●Humidity: below 85%, condensed sewage; ●Air quality: non-corrosive. No flammable, harmful gas, no pollutants, dust, etc. |
Product Features
A variety of cylinder options can be adapted to the process requirements of different processing workpieces
Special low-friction cylinders, not common market cylinders, thick bore, overcoming the deflection of the cylinder shaft; suitable for workpieces with high pressure and long time processing (such as sapphire, silicon carbide)
You can also choose to use imported brand cylinders, with good friction coefficient, which can realize the slow and light pressure of the P.P plate to meet the needs of processing fragile and thin workpieces.
Multi-stage pressure control, the pressure control is more accurate and stable, ensuring that workpieces that cannot withstand high pressure can also be processed smoothly
P.P plate automatic positioning mechanism, convenient for personnel to load and unload
4 P.P disks can be independently controlled, four axes can be processed at the same time, or a single P.P can be processed independently
4 P.P disk frequency conversion motors are forced to drive, P.P speed is adjustable
The 4 P.P disks can be operated individually on both sides, or can be operated collectively on the touch screen
4 P.P disks have independent voltage stabilizing system
4 P.P disks can achieve "fast decline, slow decline, slow rise and fast rise”
The P.P plate pressure is controllable, ensuring that it cannot withstand the processing of high-pressure wafers
