Our Core Product Lines
We are dedicated to the research and application of high-precision planar grinding and polishing technology, and we manufacture a series of high-quality precision single and double-sided grinding and polishing machines.
Morinaga's single-sided polishing machines (ES32B/36B and ES50B series) are built to deliver a uniformly flat, high-clarity surface finish on one side of thin, brittle, and hard workpieces. The plate-based design keeps flatness and finish consistent across a full production batch, whether the run is a handful of prototype samples or a continuous high-volume order.
Each unit ships with digital speed, pressure, and dressing controls, so operators can dial in a repeatable recipe once and reuse it across shifts. The frame and lapping plate are engineered to resist the vibration and thermal drift that would otherwise round off edges or create waviness across a large-diameter part.
| Material Group | Typical Parts |
|---|---|
| Semiconductor | Silicon wafers, germanium wafers, memory substrates |
| Optical & Sapphire | LED sapphire substrates, optical glass, quartz crystal blanks |
| Ceramic & Piezoelectric | Ceramic substrates, piezoelectric crystal wafers |
| Precision Mechanical | Thin metal seal rings, hard/brittle precision components |
After single-sided grinding and polishing, parts can reach a flatness of 0.3 μm, parallelism of 1 μm, thickness difference of 1 μm, and a surface roughness below 0.01 μm — figures aimed squarely at semiconductor and precision optical production lines.
Zhejiang Morinaga Optical & Electronic Equipment Co., Ltd. was founded in 2011 and has since focused on precision planar grinding and polishing technology. The company designs and builds single- and double-sided lapping/polishing equipment used to process thin, brittle, and hard materials — from LED sapphire substrates and silicon/germanium wafers to ceramic substrates, optical glass, quartz crystal, and other semiconductor-grade materials.
Morinaga's roots trace back to Taizhou Yong'an Machinery, established in 1993 to make fixtures and precision parts for grinding and polishing equipment. That mechanical know-how carried directly into the Morinaga machine lineup, and later expanded further through Zhejiang Yong'an Intelligent Equipment, which supplies transmission components — worm gear reducers, helical gear reducers, and direct-drive rotary tables — for CNC and automated production lines.
Over more than a decade of manufacturing, Morinaga has built up a portfolio of patents, quality-system certificates, and industry qualifications that back the engineering behind every single-sided polishing machine leaving the factory. These records support both the company's technical claims and its ability to serve semiconductor, sapphire, and piezoelectric crystal customers under consistent quality control.
Full-resolution certificates and additional honors are available on the Company Honors page.
What is a single-sided polishing machine used for?
It's used to grind and polish one face of thin, hard, or brittle workpieces — such as sapphire substrates, silicon and germanium wafers, ceramic substrates, optical glass, and quartz crystal — down to a precise, uniform, mirror-flat finish suitable for downstream semiconductor or optical processing.
What precision can Morinaga's single-sided polishing machines achieve?
Depending on the material and recipe, workpieces processed on the ES32B/36B and ES50B series can reach a flatness of 0.3 μm, a parallelism of 1 μm, a thickness difference of 1 μm, and a surface roughness under 0.01 μm.
Which materials and industries are these machines suited for?
They are commonly used across the semiconductor, sapphire, and piezoelectric crystal industries, processing materials such as LED sapphire substrates, silicon/germanium wafers, ceramic substrates, optical glass, quartz crystals, and other hard, brittle materials that require a flat, low-roughness surface.
Can the machine be customized, and what support comes with it?
Yes. Morinaga's engineering team can adjust plate size, fixture design, and process parameters to match a customer's specific part geometry and target tolerances, and offers process guidance plus after-sales technical support to help commission the machine on the production line.
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