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Our Core Product Lines

We are dedicated to the research and application of high-precision planar grinding and polishing technology, and we manufacture a series of high-quality precision single and double-sided grinding and polishing machines.

  • 6B/6.4B

    High-Precision Double-Sided Grinding/Polishing Machine

  • 9B/9.6B

    High-Precision Double-Sided Grinding/Polishing Machine

  • 12B/13B/13.9B

    High-Precision Double-Sided Grinding/Polishing Machine

  • 16B/18B

    High-Precision Double-Sided Grinding/Polishing Machine

  • 16B/22B

    High-Precision Double-Sided Water-Cooled Grinding/Polishing Machine

  • 20B/22B/24B

    High-Precision Double-Sided Grinding/Polishing Machine

  • 28B/30B/32B/35B

    High-Precision Double-Sided Grinding/Polishing Machine

  • ES32B/36B

    Single-Sided Polishing Machine

  • ES50B

    Single-Sided Polishing Machine

Product Category

High-Precision Single & Double-Sided Lapping/Polishing Machines

Every Morinaga machine is built around the material it has to process. Rather than pushing customers toward one fixed abrasive method, we configure plate speed, down-force and slurry or diamond-media delivery around the actual part — sapphire wafer, silicon or germanium substrate, ceramic, optical glass or quartz crystal — so the finished surface meets its flatness and roughness target with the fewest possible process steps.

In a double-sided machine, parts sit loose in thin planetary carriers between two counter-rotating plates, so every piece sees an even, averaged pass across the whole plate rather than a single fixed track. The result is a batch that comes off the machine matched to within microns of one another, not just individually flat.

Factors We Engineer Around for Every Order

  • Material hardness, brittleness and part geometry
  • Plate rotation speed and down-force control
  • Plate flatness and dressing frequency
  • Abrasive type and size — slurry, fixed diamond or fine-grinding media
  • Carrier design and loading/unloading method

Current double-sided series (plate diameter, mm):

Zhejiang Morinaga Optical & Electronic Equipment Co., Ltd manufacturing facility

About the Manufacturer

Morinaga Optical & Electronic Equipment

Founded in 2011, Zhejiang Morinaga Optical & Electronic Equipment Co., Ltd. focuses on high-precision planarization grinding and polishing technology. We design and build single- and double-sided grinding/polishing machines used to process non-metallic and metallic hard, brittle, thin-section parts — LED sapphire substrates, silicon and germanium wafers, ceramic substrates, optical glass, quartz crystals, LCD panels, memory hard-disk substrates and other semiconductor materials.

Backed by an engineering team with roots in precision machine components dating back to 1993, Morinaga machines are relied on across the semiconductor, sapphire and piezoelectric crystal industries, where flatness, parallelism and surface finish tolerances leave no room for variation between parts or between batches.

We operate on a simple management principle: put people first, build the business on integrity, and keep investing in process innovation — so every machine we ship is one we would run in our own production line.

0.3 μmAchievable flatness after single/double-sided processing
1 μmParallelism and thickness-difference tolerance
< 0.01 μmSurface roughness (Ra) on finished parts
2011Year Morinaga was established in Zhejiang, China

Recognition

Company Honors

Qualifications, patents and industry awards Morinaga has earned as a precision lapping and polishing machine manufacturer.

View all honors & certificates
Morinaga company honor certificate 01Morinaga company honor certificate 02Morinaga company honor certificate 03Morinaga company honor certificate 04Morinaga company honor certificate 05Morinaga company honor certificate 06

Why Morinaga

Precision Lapping & Polishing Machines, Engineered for Semiconductor & Optical Manufacturing

Morinaga designs its double-sided lapping and polishing machines and single-sided polishing machines for manufacturers who cannot compromise on flatness, parallelism or surface roughness — semiconductor fabs, sapphire substrate producers, piezoelectric crystal makers, and precision optical component shops sourcing equipment worldwide.

Because every ED- and ES-series machine ships with plate diameter, carrier design, drive ratio and abrasive-delivery method matched to the customer's part, teams evaluating a new high-precision lapping machine can start from a proven platform instead of a from-scratch design — shortening qualification time without narrowing the process window.

Common Applications

Frequently Asked Questions

Q.What's the difference between single- and double-sided lapping/polishing machines?

A single-sided machine (Morinaga's ES-series) processes one face of the part at a time against a single rotating plate — well suited to parts that need one reference surface finished to a specific finish. A double-sided machine (Morinaga's ED-series, e.g. 6B–35B) processes both faces simultaneously between two counter-rotating plates, so it also controls parallelism and thickness variation across the batch, not just flatness on one side.

Q.What flatness and parallelism can a Morinaga machine achieve?

With correctly matched process parameters, Morinaga single- and double-sided machines routinely reach a flatness of 0.3 μm, parallelism and thickness difference of 1 μm, and a surface roughness below 0.01 μm — tolerances suited to semiconductor wafer and precision optical component production.

Q.Which materials can be processed on these machines?

Morinaga machines are built to handle hard, brittle, thin-section materials, including LED sapphire substrates, silicon and germanium wafers, ceramic substrates, optical glass, quartz crystal, LCD panels and memory hard-disk substrates.

Q.Can Morinaga customize a machine for a specific part or process?

Yes. Plate diameter, carrier and drive configuration, down-force control and abrasive-delivery method (slurry, fixed diamond, or fine-grinding media) are all specified around the customer's material, target tolerance and production volume before the machine is built.

Q.Where are Morinaga lapping and polishing machines manufactured?

Machines are designed and manufactured at Morinaga's facility in Xiuzhou District, Jiaxing City, Zhejiang Province, China, and shipped to customers internationally.

Ready to specify your next lapping or polishing machine?

Tell our engineering team your material, target tolerances and batch size — we'll recommend the right series and configuration.

Contact Our Engineering Team

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