Our Core Product Lines
We are dedicated to the research and application of high-precision planar grinding and polishing technology, and we manufacture a series of high-quality precision single and double-sided grinding and polishing machines.
Product Category
Every Morinaga machine is built around the material it has to process. Rather than pushing customers toward one fixed abrasive method, we configure plate speed, down-force and slurry or diamond-media delivery around the actual part — sapphire wafer, silicon or germanium substrate, ceramic, optical glass or quartz crystal — so the finished surface meets its flatness and roughness target with the fewest possible process steps.
In a double-sided machine, parts sit loose in thin planetary carriers between two counter-rotating plates, so every piece sees an even, averaged pass across the whole plate rather than a single fixed track. The result is a batch that comes off the machine matched to within microns of one another, not just individually flat.
Current double-sided series (plate diameter, mm):
About the Manufacturer
Founded in 2011, Zhejiang Morinaga Optical & Electronic Equipment Co., Ltd. focuses on high-precision planarization grinding and polishing technology. We design and build single- and double-sided grinding/polishing machines used to process non-metallic and metallic hard, brittle, thin-section parts — LED sapphire substrates, silicon and germanium wafers, ceramic substrates, optical glass, quartz crystals, LCD panels, memory hard-disk substrates and other semiconductor materials.
Backed by an engineering team with roots in precision machine components dating back to 1993, Morinaga machines are relied on across the semiconductor, sapphire and piezoelectric crystal industries, where flatness, parallelism and surface finish tolerances leave no room for variation between parts or between batches.
We operate on a simple management principle: put people first, build the business on integrity, and keep investing in process innovation — so every machine we ship is one we would run in our own production line.
Recognition
Qualifications, patents and industry awards Morinaga has earned as a precision lapping and polishing machine manufacturer.
Why Morinaga
Morinaga designs its double-sided lapping and polishing machines and single-sided polishing machines for manufacturers who cannot compromise on flatness, parallelism or surface roughness — semiconductor fabs, sapphire substrate producers, piezoelectric crystal makers, and precision optical component shops sourcing equipment worldwide.
Because every ED- and ES-series machine ships with plate diameter, carrier design, drive ratio and abrasive-delivery method matched to the customer's part, teams evaluating a new high-precision lapping machine can start from a proven platform instead of a from-scratch design — shortening qualification time without narrowing the process window.
A single-sided machine (Morinaga's ES-series) processes one face of the part at a time against a single rotating plate — well suited to parts that need one reference surface finished to a specific finish. A double-sided machine (Morinaga's ED-series, e.g. 6B–35B) processes both faces simultaneously between two counter-rotating plates, so it also controls parallelism and thickness variation across the batch, not just flatness on one side.
With correctly matched process parameters, Morinaga single- and double-sided machines routinely reach a flatness of 0.3 μm, parallelism and thickness difference of 1 μm, and a surface roughness below 0.01 μm — tolerances suited to semiconductor wafer and precision optical component production.
Morinaga machines are built to handle hard, brittle, thin-section materials, including LED sapphire substrates, silicon and germanium wafers, ceramic substrates, optical glass, quartz crystal, LCD panels and memory hard-disk substrates.
Yes. Plate diameter, carrier and drive configuration, down-force control and abrasive-delivery method (slurry, fixed diamond, or fine-grinding media) are all specified around the customer's material, target tolerance and production volume before the machine is built.
Machines are designed and manufactured at Morinaga's facility in Xiuzhou District, Jiaxing City, Zhejiang Province, China, and shipped to customers internationally.
Tell our engineering team your material, target tolerances and batch size — we'll recommend the right series and configuration.
Ready to Advance
Your Manufacturing Capability?
Contact our sales and engineering team today to discuss your requirements and schedule a virtual machine demonstration.