Our Core Product Lines
We are dedicated to the research and application of high-precision planar grinding and polishing technology, and we manufacture a series of high-quality precision single and double-sided grinding and polishing machines.
Morinaga's double-sided lapping/polishing machines are built for manufacturers who need consistent, repeatable flatness across thin, hard, and brittle materials. The lineup covers the ED6B through ED35B series, so shops running small-diameter substrates and shops running large-format wafers can both find a machine matched to their throughput and part size.
Each machine is engineered for planar grinding and polishing of non-metallic and metallic hard, brittle, and fragile precision components — including LED sapphire substrates, silicon and germanium wafers, ceramic substrates, optical glass, quartz crystals, LCD glass, and memory hard-drive platters. After processing, parts can reach a flatness of 0.3 μm, parallelism of 1 μm, thickness difference of 1 μm, and surface roughness below 0.01 μm — tolerances that support semiconductor chip production, precision ceramic components, optical components, and precision mechanical parts.
Founded in 2011, Zhejiang Morinaga Optical & Electronic Equipment Co., Ltd. focuses on the research and application of high-precision planarization grinding and polishing technology. The company designs and builds a full range of single- and double-sided grinding/polishing machines used to process hard, brittle materials for the semiconductor, sapphire, and piezoelectric crystal industries.
Morinaga's manufacturing roots go back further: its predecessor began producing grinding and polishing fixtures and components in 1993, and that mechanical engineering base carries through into today's machine design and build quality. The result is equipment trusted by customers who need dependable flatness and repeatability run after run.
The company operates on the principle of being responsible to employees, to the business, and to society — pairing a people-first management approach with continuous technical innovation to build long-term, mutually beneficial partnerships with customers worldwide.
Over the years, Morinaga has earned recognition from industry bodies and certification authorities for its manufacturing quality, technical capability, and continuous investment in precision grinding and polishing technology. A selection of our certificates and honors is shown below.
The machines are designed for hard, brittle, non-metallic and metallic thin precision parts, including LED sapphire substrates, silicon and germanium wafers, ceramic substrates, optical glass, quartz crystals, LCD glass, and memory hard-drive platters.
Typical results include flatness to 0.3 μm, parallelism to 1 μm, thickness difference to 1 μm, and surface roughness below 0.01 μm — tolerances suitable for semiconductor, precision ceramic, and precision optical component production.
Model selection depends mainly on part diameter, batch size, and required throughput. Smaller-diameter series (6B/6.4B, 9B/9.6B) suit lower-volume or smaller-part production, while the larger 20B–35B series are built for higher-volume, larger-diameter processing. Our team can recommend a model based on your material, target tolerances, and daily output requirements.
Yes. Machine configuration, disc size, cooling method (including water-cooled options like the 16B/22B), and fixture design can be adjusted to match your material type, part geometry, and production volume.
Our engineering team supports installation guidance, process parameter setup, and ongoing technical assistance, so the machine reaches its rated precision in your production environment.
Contact our sales and engineering team with your material type, target tolerances, and part dimensions, and we will recommend a suitable model and, where possible, arrange a virtual machine demonstration.
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